Course Details
Course Details: | Course Duration | Course Fee |
Combo Android+iPhone | 3 month | INR 60,000 |
Android Syllabus of Course:
Android Basic to Advance (Level 1 to Level 3) including Software programming eMMC/UFs chip and Hardware with Schematics Diagram.
Basic component knowledge: Resistor, Capasitor, Coil, Diode, Transistor.
IC:- Analogue IC and Digital IC
Protocol: I2C, SPI, I2S, EBI, Jtag, USB, SPMI, RFFE, MIPI
Hardware: Charging Section, Graphic Section, Light Section, Touch Section, Fingerprint Section, Camera Section, Mic Section, Ringer Section, Ear Spk Section, Head Phone Section, Sensor Section, Network Section, Power ic Section, CPU Section, eMMC Section/UFs Section, Boot Sequence, Dead Section, Fault Finding, Tracing, Minor Leakage, Primary Section Short, Secondary Section Short, DC power supply reading.
Hand-Skill: IC reball, CPU Reball, eMMC reball, swaping, Hard Black pasted cutting, removing, cleaning and fixing, use of Micro jumper, Jumper under IC, track making, dual drecker reball.
Software Basic to Advance: Installing usb driver for all mobile phone flashing, unlocking with UMT pro and Unlock Tool Qualcomm CPU, MTK CPU, SPD Unisoc CPU and Exynos CPU.
eMMC/UFs basic to advance with UFI Box, Easy Jtag Plus and MIPI Tester Box: Read and write dum, read and write excluded with dump, Read and write Security Partition, bad health repair 90% of consumed, repair Cid, Fix GPT table, read write FFU file, RPMB clean, without data loss unlocking with ISP, unpacking ofp file, eMMC change Process and CPU change Process.
iPhone Syllabus of Course:
iPhone Basic to Advance (Level 3)
Basic Knowledge about Electronics, Face ID, Battery Health, Display Message, camera issue, fault finding with Dc reading, Panic Problem, Power Sequence, Boot Sequence, Network Section, Charging Section, Graphic Section, Light Section, Touch Section, Fingerprint Section, Camera Section, Mic Section, Ringer Section, Ear Spk Section, Head Phone Section, Sensor Section, Network Section, Power ic Section, CPU Section Nand Programming, Swap with data and without data, IC Drill, PCB Layer Reballing Schematic Diagram with ZXW and JCID drawing.